Trade Mark Journal No.2026/003 16 January 2026

WO0000001893323 (16,35,42)

Office of origin: United States of America

Date of International Registration:10 November 2025
Date of designation in the UK: 10 November 2025
Image for mark 1893323 UCIE

International priority date claimed: 12 June 2025 (United States of America) (99231708)
Class 16
Printed material, namely, technical documents featuring voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects.
Class 35
Association services, namely, promoting the design and development of voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, for its members.
Class 42
Developing and establishing voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, and technical documents for the same.

Universal Chiplet Interconnect Express, Inc.

Representative: Frank X. Curci Buchalter, PC, 805 S.W. Broadway, Suite 1500, Portland OR 97205, UNITED STATES OF AMERICA