# Trade Mark Journal No.2026/031 31 July 2026

## WO0000001927858 (9)

Office of origin: United States of America

Date of International Registration:25 May 2026
Date of designation in the UK: 25 May 2026

Class 9
  Semiconductor chips; semiconductor chiplets; semiconductor devices; semiconductor dies; semiconductor chip sets; photonic microchips; photonic integrated chips (PICs); electrical connections; electrical cables; electrical connectors; electrical wires; silicon chips; silicon wafers; silicon carbide diodes; electronic semi-conductors; electronic circuits; electronic cables; optical cables; optical fibers; optical semiconductors; optical receivers; optical lenses; optical fiber cables; optical fiber connectors; electronic and optical communications instruments and components, namely, optical transmitters; electronic and optical communications instruments and components, namely, optical receivers; electronic and optical communications instruments and components, namely, optical transceivers; optical fibers sold as a component of fiber optical cables; electrical and optical cables; electrical interconnect cables; peripheral component interface (PIC) hardware; computer network interface devices; communications servers; fiber optics; fiber optic cables.

JIANQIANG LI