# Trade Mark Journal No.2026/031 31 July 2026

## WO0000001928743 (9,40,42)

Office of origin: China

Date of International Registration:4 February 2026
Date of designation in the UK: 4 February 2026

International priority date claimed: 7 January 2026 (China) (89568377)

Class 9
  Integrated circuits; wafers for integrated circuits; semiconductors; memory cards; computer programs, recorded; computer memory devices; data processing apparatus; microprocessors; solid state drives; central processing units; electronic memories; integrated circuit cards; USB flash drives; computers; computer peripheral devices; counters; face recognition equipment; electronic surveillance apparatus; optical fibres [light conducting filaments]; transistors; semiconductor devices; electronic chips; chips [integrated circuits].
Class 40
  Custom assembling of materials for others; metal plating; printing; recycling of chemicals; processing of semiconductor wafers; custom manufacture of semiconductor wafers; encapsulation of semi-conductors; custom manufacturing of chips [integrated circuits] for others; encapsulation of semiconductors for others; custom manufacture of semiconductor circuits.
Class 42
  Design of integrated circuits; conducting technical project studies; design of semiconductors; scientific research; technological research; quality testing of products; technical measuring; testing the functionality of apparatus and instruments; industrial design; packaging design; electronic data storage; computer software design.

Yangtze Memory Technologies Co., Ltd.

Representative: BEIJING PAT INTELLECTUAL PROPERTY OFFICE, Unit 503, 5/F, Daheng Scitech Building, South Tower,, No. 3 Suzhou Street, Haidian District, 100080 Beijing, CHINA