Trade Mark Journal No.2026/003 16 January 2026
WO0000001892834 (16,35,42)
Office of origin: United States of America
The mark consists of two interconnected interrupted squares offset at a diagonal, the upper displayedin green and the lower displayed in blue, followed by the bolded letters UCIe in large font, together forming the first line of the design, followed by the words "Universal Chiplet" in bold smaller font with "Chiplet" displayed in green forming the second line of text, and the third line being formed by the words "Interconnect Express" in standard font.
The mark contains the colours blue and green.
The mark consists of two interconnected interrupted squares offset at a diagonal, the upper displayed in green and the lower displayed in blue, followed by the bolded letters UCIe in large font, together forming the first line of the design, followed by the words "Universal Chiplet" in bold smaller font with "Chiplet" displayed in green forming the second line of text, and the third line being formed by the words "Interconnect Express" in standard font.
- Class 16
- Printed material, namely, technical documents featuring voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects.
- Class 35
- Association services, namely, promoting the design and development of voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, for its members.
- Class 42
- Developing and establishing voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, and technical documents for the same.
Universal Chiplet Interconnect Express, Inc.
Representative: Frank X. Curci Buchalter, PC, 805 S.W. Broadway, Suite 1500, Portland OR 97205, UNITED STATES OF AMERICA