# Trade Mark Journal No.2026/003 16 January 2026

## WO0000001892834 (16,35,42)

Office of origin: United States of America

Date of International Registration:21 October 2025
Date of designation in the UK: 21 October 2025

The mark consists of two interconnected interrupted squares offset at a diagonal, the upper displayedin green and the lower displayed in blue, followed by the bolded letters UCIe in large font, together forming the first line of the design, followed by the words "Universal Chiplet" in bold smaller font with "Chiplet" displayed in green forming the second line of text, and the third line being formed by the words "Interconnect Express" in standard font.

The mark contains the colours blue and green.

The mark consists of two interconnected interrupted squares offset at a diagonal, the upper displayed in green and the lower displayed in blue, followed by the bolded letters UCIe in large font, together forming the first line of the design, followed by the words "Universal Chiplet" in bold smaller font with "Chiplet" displayed in green forming the second line of text, and the third line being formed by the words "Interconnect Express" in standard font.

International priority date claimed: 12 June 2025 (United States of America) (99231704)

Class 16
  Printed material, namely, technical documents featuring voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects.
Class 35
  Association services, namely, promoting the design and development of voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, for its members.
Class 42
  Developing and establishing voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, and technical documents for the same.

Universal Chiplet Interconnect Express, Inc.

Representative: Frank X. Curci Buchalter, PC, 805 S.W. Broadway, Suite 1500, Portland OR 97205, UNITED STATES OF AMERICA