# Trade Mark Journal No.2026/011 13 March 2026

## WO0000001904394 (16,35,42)

Office of origin: United States of America

Date of International Registration:21 October 2025
Date of designation in the UK: 21 October 2025

International priority date claimed: 12 June 2025 (United States of America) (99231699)

Class 16
  Printed material, namely, technical documents featuring voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects.
Class 35
  Association services, namely, promoting the design and development of voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, for its members.
Class 42
  Developing and establishing voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, and technical documents for the same.

Universal Chiplet Interconnect Express, Inc.

Representative: Frank X. Curci Buchalter, PC, 805 S.W. Broadway, Suite 1500, Portland OR 97205, UNITED STATES OF AMERICA