Trade Mark Journal No.2026/027 3 July 2026
WO0000001923062 (1,6)
Office of origin: Japan
Date of International Registration:30 March 2026
Date of designation in the UK:
30 March 2026
International priority date claimed: 26 February 2026
(Japan)
- Class 1
- Adhesives for use in the manufacture of electronic components; tacking agent [temporary fixing adhesives]; tacking agent, namely, temporary fixing adhesives for industrial use; temporary fixing adhesives used for electronic components; temporary fixing adhesives; fixative adhesives; fixative adhesive substances; temporary fixing adhesives for use in the manufacture of semiconductors; temporary fixing adhesives used for temporary binding semiconductor chips in assembly processes of electronic components and semiconductors; adhesives for electronic components; adhesives for semiconductors; copper-based industrial chemicals in the form of pastes used in bonding and sintering processes of electronic components; adhesives for industrial purposes; adhesive substances for use in industry; adhesive substances.
- Class 6
- Powder of copper in the form of pastes used in bonding and sintering processes of electronic components; metals in the form of pastes used in bonding and sintering processes of electronic components; metal preforms used in bonding and sintering processes of electronic components; preformed copper used in bonding and sintering processes of electronic components; copper preforms used in bonding and sintering processes of electronic components; semi-processed copper used in bonding and sintering processes of electronic components; non-ferrous metals in the form of foils used in bonding and sintering processes of electronic components; copper used as a bonding material of metal used for electronic components; powder of copper in the form of pastes used as a bonding material for electronic components such as power semiconductors; metals in the form of pastes used as a bonding material for electronic components such as power semiconductors; metal preforms used as a bonding material for electronic components such as power semiconductors; preformed copper used as a bonding material for electronic components such as power semiconductors; copper preforms used as a bonding material for electronic components such as power semiconductors; semi-processed copper used as a bonding material for electronic components such as power semiconductors; non-ferrous metals in the form of foils used as a bonding material for electronic components such as power semiconductors; non-ferrous metals in the form of sheets used as a bonding material for electronic components such as power semiconductors; copper used as a bonding material of metal used for electronic components such as power semiconductors; copper and its alloys in the form of pastes used for sintering in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for die attach insemiconductors manufacturing processes; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of sheets used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; preforms of copper and copper alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; semi-processed copper and its alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for die attach in manufacturing processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates on printed circuit boards in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in manufacturing processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used in sintering processes; powder of copper in the form of pastes used in sintering processes; copper foils used in sintering processes; copper and its alloys used in sintering processes; copper and its alloys in the form of pastes used for sinter joining; powder of copper in the form of pastes used for sinter joining; copper foils used for sinter joining; copper and its alloys used for sinter joining.
Mitsui Kinzoku Company, Limited
Representative: KONNO Akio, FUJI Patent Law Firm,, Yurakucho Denki Bldg. South Tower 16F,, 7-1, Yurakucho 1-chome, Chiyoda-ku, Tokyo 100-0006, JAPAN